When manufacturing and processing connectors, most factories will use the welding process. So what is the wetting and diffusion of connector welding?
At the beginning of welding, the connector product applies a wax like substance called "flux" to the metal. This method can wet the welding material, effectively remove the oxide and clean the surface metal. Wetting metal is very necessary to connect the molten solder to the solid substrate and connect the two metals. Because of the different interface energy between the two metals, it needs flux to connect them.
When the solder of the connector melts and fits with the substrate, part of it will be dissolved, resulting in the change of dissolution rate. Especially depends on the combination of solder and substrate. The increase of solder temperature can also change the dissolution rate.
When the molten solder interacts with the substrate, it produces an inter metallic compound or "IMC". Due to the frequent use of these metals in electrical interconnection, these IMC can usually exist in the form of tin copper and tin nickel. When creating IMC, they can be identified by using electronic instruments such as X-rays. XRD and SEM EDAX are examples of this advanced method of identifying IMC after welding metal.
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