Smart, Rugged interconnects for electrical connection of telemetry units

Sunkye connectors help telemetry systems endure harsh conditions without degradation of signal or performance in military applications.

Telemetry units are provided in various form factors to be used in a wide platform spectrum from large UAVs to dense platforms such as missiles, rockets, etc. Integrated and stackable data acquisition systems capable of collecting and recording different digital and analog data are among the products offered. And telemetry systems allow the automatic monitoring, alerting, and record-keeping necessary for efficient and safe operation, collecting data from the telemetry equipment such as spacecraft and satellites.

Over the years, telemetry technologies are increasingly essential to military operations. Miniaturized connectors that can operate in all environmental conditions are critical to designing equipment that supports the military and defense.

Due to the particularity and versatility of the military applications, Sunkye connectors used in telemetry equipment meet the characteristics of shock resistance, vibration resistance, extreme temperature resistance, and sealing etc.

Sunkye connectors can be determined by environment preference. Powerful interconnects based on MIL-DTL-83513 and MIL-DTL-32139 specifications can be customized to different form factors that meet specialized requirements. Sunkye’s Micro and Nano miniature connectors use in extreme environments and are super small and lightweight. Whether telemetry equipment is often exposed to extreme temperatures or needs to be protected against dust, water and corrosion, as long as there are requirements for extreme miniaturization, sealing, high density, lightweight, and high reliability, Sunkye connectors can be used.

Sunkye miniature connectors on MIL-DTL-83513 and MIL-DTL-32139 specifications:

Sunkye Connectors perfectly meets these applications’ specific requirements:

☑ Meet MIL-DTL-32139 and MIL-DTL-83513
☑ Twist Pin Contacts
☑ compact and lightweight
☑ Miniaturization and high density
☑ sealed and hermetic solutions
☑ Resistance to vibration, shock
☑ Fast data transmission over long distances