The miniaturization of connectors is developed from the miniaturization of military electronic equipment. As early as World War II, the United States used an unsealed rectangular connector with a center distance of 2.54 mm in military equipment. The miniaturization of connectors developed rapidly in the 1960s and 1970s. The connector with a center distance of 2.54 mm belongs to the common product, and even reaches 0.381 mm in some military occasions. At that time, the development of micro d subminiature connectors
had reached a fairly high level.
In recent years, with the rapid development of electronic technology, products are constantly updated and replaced. Portable products are becoming more and more popular, which greatly promotes the development of micro d subminiature connectors. The development of micro-connector
has reached a new stage. Connector technology with spacing of 1.27 mm has basically reached maturity. Common product spacing has also reached the level of 1.0 mm to 0.8 mm. At present, there are 0.3 mm ultra-micro FPC connector products. Overall, the volume and weight of connectors are also greatly reduced. For example, Molex's ultra-thin 890 series D-Sub sockets on I/O take up 40% less space than the traditional models. The B802 connector manufactured by French manufacturer weighs only 1G.
With the continuous development of electronic technology, besides the increasingly multi-functional, high-performance and intelligent electronic equipment, miniaturization (even portability) has become one of the most important and obvious characteristics of its development. The portability of electronic equipment requires that the size of the connector, which is the necessary component to form a complete system, is reduced and the installation density is increased. Miniaturization plays an extremely important role in the development of connector industry.
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